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Release Date:2026-09-17Precision Etching | High-Accuracy Photochemical Etching for Ultra-Thin Precision Metal ComponentsPrecision etching (photochemical etching) delivers high-accuracy, burr-free, stress-free micro metal parts. Supports complex micro patterns, ultra-thin foils from 0.02 mm, ideal for electronics, semic -
Release Date:2026-09-17Etched Metal Shims, Washers & Spacers | Precision Photochemically Etched Thin Metal GasketsCustom photochemical etched metal shims, washers and spacers in stainless steel, copper, brass, aluminum and titanium. Burr-free, stress-free, tight tolerances from 0.02 mm thickness for precision adj -
Release Date:2026-09-17Molybdenum Etching | Precision Photochemical Etching for Molybdenum & Mo Alloy ComponentsCustom photochemical etching for molybdenum sheets and foils. Burr-free, stress-free precision Mo components for high-temperature electronics, semiconductor, medical and aerospace applications. Thickn -
Release Date:2026-09-17Sheet Metal Etching | Precision Photochemical Etching for Thin Sheet Metal ComponentsPhotochemical sheet metal etching produces burr-free, stress-free precision thin metal components. No hard tooling, fast prototyping, suitable for stainless steel, copper, aluminum, titanium and alloy -
Release Date:2026-09-16Ultra-Fine Pitch Electroformed Steel Mesh | High Precision Electroformed Nickel Mesh for Semiconductor & FiltrationCustom ultra-fine pitch electroformed steel mesh manufactured by nickel electroforming. Uniform micro apertures, ultra-smooth hole walls, micron-level accuracy, for semiconductor packaging, precision -
Release Date:2026-09-16Electroforming Stencils for BGA Packaging | Ultra Smooth Nickel Stencil for BGA Solder Ball PlacementCustom electroforming nickel stencils for BGA packaging. Ultra-smooth aperture walls, micron-level precision, low ball-jamming rate, ideal for fine pitch BGA and FCBGA solder ball placement in advance -
Release Date:2026-09-16Ball Mask Stencil | High Precision Solder Ball Placement Mask for Semiconductor PackagingCustom ball mask stencil for semiconductor flip chip, BGA and FCBGA packaging. Made by chemical etching or electroforming, micron-level precision, burr-free apertures, to realize accurate solder ball -
Release Date:2026-09-16FCBGA Ball Placement Stencil | High Precision Solder Ball Mask for Advanced Semiconductor PackagingCustom FCBGA ball placement stencil for flip chip BGA packaging. Available in chemical etching and electroforming processes, ultra-smooth hole walls, micron-level accuracy, for high-density AI chip an -
Release Date:2026-09-15Custom Lead Frame | Photochemical Etching Precision Semiconductor Lead FramesCustom photochemical etched lead frames feature ultra-fine pins, burr-free and stress-free. High precision custom lead frames for semiconductors, IC packages, optoelectronic devices and sensors. -
Release Date:2026-09-15Custom Speaker Grills | Photochemically Etched Precision Metal Speaker GrillesCustom photochemical etched metal speaker grills with uniform micro holes, burr-free and flat surface. Custom patterns, aperture sizes and shapes for audio speakers, earphones, loudspeakers and automo -
Release Date:2026-09-15Custom Metal Engraving | Precision Photochemical Etching for Custom Metal Engraved PartsCustom metal engraving via photochemical etching delivers high definition, intricate permanent marks and patterns on thin metal foils. Burr-free, stress-free, no expensive tooling, ideal for logos, te -
Release Date:2026-09-15Metal Mesh Filter & Screens | Custom Photochemically Etched Precision Metal Filter MeshCustom photochemical etched metal mesh filters and screens with uniform micro apertures, burr-free and stress-free. Available in stainless steel, nickel, titanium, copper for medical, automotive, food
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