Electroplating Principle
Electroforming is a specialised processing technology that uses electrolytic deposition of metals to manufacture precision metal parts. The basic principle involves immersing a conductive mould as the cathode into an electrolyte solution (such as nickel sulphate or copper sulphate), where metal ions are reduced and gradually deposited on the mould surface under the influence of an external current, ultimately forming an independent metal product with a shape opposite to that of the mould.
Process Flow


- 01FILM (CAD Output)
- 02Raw material preparation
- 03Pre-treatment (cleaning)
- 04Dry film Lamination (lamination)
- 05LDI
- 06Electroforming
- 07Drying
- 08Etching (ETCHING)
- 09Peeling (shedding operation)
- 10Check packaging, out of the warehouse
Advantages of the electroforming process

Achieve micron-level (1-10μm) or even nanometre-level structural replication to meet the stringent dimensional requirements of precision devices.

Supports complex geometric structures such as three-dimensional irregular shapes, hollows, and micro-holes that are difficult to achieve with traditional processing methods.

Electroplating layers have low internal stress, preventing part deformation or cracking and improving product reliability

Surface roughness can reach Ra 0.05μm or less, reducing subsequent polishing processes.

Can process various metals and alloys such as nickel, copper, gold, silver, platinum, etc., to meet different functional requirements.

Good repeatability in mass production, suitable for manufacturing highly standardised precision part

Combined with lithography technology, high-resolution pattern transfer (such as micro gears and MEMS components) can be achieved.

No expensive moulds required, particularly suitable for customised, small-batch precision parts production

Multiple layers of materials can be stacked to give parts composite properties such as conductivity, wear resistance, and corrosion resistance.
Intercomparison of etching, stamping and other process characteristics
Process Features | Photochemical etching | Laser Cutting | Stamping | Wire cutting | Waterjet Cutting | Electroforming |
---|---|---|---|---|---|---|
Sample Making | Low cost | Low cost | High cost | Low cost | Low cost | Moderate cost |
Material type | Almost all metals | Almost all metals | Almost all metals | Carbon steel and most metal alloys | Almost all metals | Mainly nickel, copper, silver, gold |
Metal hardness | No restrictions | No restrictions | Hardness is too large, too small, easy to break the metal are not available | Hardness needs to be chosen carefully | Hardness needs to be chosen carefully | Approx 200-670 HV |
Scratching | No scratches | Scratches on the edges of the cut | Scratches on the edges of the cut | The material will be twisted and deformed. Structural changes | The cut edge will have a few A few scratches | No obvious scratches |
Burr | Burr-free | Fine burr | Local burrs | Fine burr | Fine burr | Burr-free |
Flexibility for design changes | Fast, easy and efficient | Fast, easy and efficient | Very time consuming and costly | Very time consuming and costly | Fast, easy and efficient | Fast, easy and efficient |
Process Time | 48 hours | 48 hours | A few weeks | 48 hours | 48 hours | 5 hours |
Material thickness on Tolerance effect | ±10% | ±5% | ±10% | ±10% | ±15% | ±15% |
product packaging. Is it easy to transfer | Yes | Yes | Very difficult | Yes | Yes | Yes |
Application of etching process


Semiconductor, LED industry solutions
Precision electroforming provides high-precision micro-nano processing solutions for the semiconductor and LED industries, suitable for the manufacture of complex structures. In the semiconductor field, electroforming technology is used to manufacture lead frames, microelectromechanical systems (MEMS) and TSV (through-silicon via) metallisation, ensuring high conductivity and dimensional accuracy. In the LED industry, electroforming is used to produce high-reflectivity brackets, fine electrodes and micro-lens arrays, improving light efficiency and heat dissipation performance. Electroforming processes can process materials such as copper, nickel, and gold, and when combined with lithography technology, achieve micron-level pattern replication, meeting the needs of small-batch, high-customisation production. Its advantages include high resolution, low stress, and excellent mechanical properties, driving the development of semiconductor and LED devices towards smaller sizes and higher performance.


5G Industry Solutions


Medical, precision engineering industry solutions


Electronics, 3C industry solutions


Photovoltaic Industry Solutions

