Semiconductor, LED industry R & D technology continues to improve, the product for component performance, efficiency, miniaturization requirements are increasingly high, usually require processing less than 0.1mm wall thickness on the plate to do structural processing, these requirements through the unique series of manufacturing technology of the Zhuolida company to ensure that the tolerance within microns.

      Contactors (spring terminals) for semiconductor wafers, package inspection, lead frames for semiconductor packages, test heads for probe cards/IC sockets, and guide plates.