Overview

A custom brass atomizing screen is a photochemically machined micro-hole array fitted into a spray head, humidifier or fuel nozzle to break a liquid into a fine, uniform mist. A photoresist mask transfers the hole pattern onto thin brass sheet, and after development the unprotected metal is dissolved so hole diameter, pitch and profile are formed in one pass, with smooth burr-free walls and none of the roll-over a punch leaves. Brass H62/H65/C2680 and phosphor bronze are the usual substrates, run at 0.05–0.5 mm, with micro-holes down to 0.05 mm and pitches to 0.15 mm.

For fluid and spray-equipment buyers, a custom brass atomizing screen addresses three problems: drilled parts have wide pitch and coarse droplets, punched meshes carry burrs that snag debris and clog over time, and woven cloth has no fixed aperture so flow drifts between lots. Photochemical etching locks the whole array from a film, giving repeatable flow and droplet distribution, and the same artwork can produce tapered holes, straight holes or zoned diameters so one screen both atomizes and directs flow. A revision is a new film rather than a new tool, which makes tuning spray angles inexpensive.

Parameter Window

• Available Materials: brass H62/H65/C2680, phosphor bronze, with 304/316L stainless steel and nickel as alternatives
• Material Thickness Range: 0.05–0.5 mm
• Tolerance: ±0.01 mm on hole diameter, ±0.02 mm on outer profile
• Minimum Feature: 0.05 mm micro-hole, 0.15 mm pitch, tapered or straight holes
• Surface Options: polishing, nickel plating, ultrasonic cleaning, passivation, electrolytic deburr
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Artwork & Flow Review — Convert the hole array to vector artwork and check diameter, pitch and target flow against thickness.
2. Material Selection — Match H62/H65 or phosphor bronze temper and surface to the medium's corrosiveness and required stiffness.
3. Cleaning & Lamination — Degrease both faces and laminate dry-film resist so no bubbles are trapped under micro-holes.
4. UV Exposure — Expose through high-resolution film with the array registered to the sheet edge for panel consistency.
5. Development — Wash out unexposed resist to open the holes, then inspect under magnification for blocked apertures.
6. Etching — Spray a brass-compatible etchant, controlling time and conveyor speed for wall taper and clean breakthrough.
7. Stripping & Finishing — Remove resist, neutralize, then polish, plate or passivate, followed by ultrasonic cleaning of debris.
8. Inspection & Packaging — Measure hole diameter, flow rate and wall finish against the approved sample, then pack on interleaf film.

Core Advantages

1. Uniform hole diameter: The array holds ±0.01 mm, so flow rate and droplet distribution are repeatable and calibratable.
2. Burr-free walls: Chemical removal leaves no roll-over or burr, so debris does not snag and the screen resists clogging.
3. No hard tooling: A new diameter or layout is a new film, keeping multi-spec, low-volume orders economical.
4. High hole density: 0.05 mm holes on 0.15 mm pitch give finer, more even mist per unit area.
5. Designable hole profile: Tapered, straight or zoned diameters form in one pass to tune spray angle and flow direction.
6. Machinable and corrosion-resistant: Brass lets the custom brass atomizing screen balance easy machining with water resistance for continuous aqueous duty.

Typical Applications

• Humidifier and misting heads: Dense micro-holes that produce quiet, low-energy, even mist.
• Fuel and burner nozzles: Tapered holes that set spray angle and flow for cleaner combustion.
• Agricultural and coating sprayers: Chemical-resistant arrays that resist clogging over long spraying cycles.
• Aroma and cosmetic nebulizers: Fine mist with a brass finish that doubles as a decorative part.
• Medical nebulizer plates: Tight hole uniformity for stable droplet distribution and dose control.
• Gas-liquid distribution plates: Combined flow straightening and even distribution into a downstream chamber.

Design Notes & Process Considerations

1. Hole-to-thickness ratio: Keep hole diameter at least 1 × material thickness, or taper will pinch the exit before breakthrough.
2. Flow callout: State target flow, pressure drop and fluid viscosity, not just hole diameter, so results can be verified.
3. Hole profile and taper: Declare straight or tapered holes and note entry-to-exit diameter difference and spray direction.
4. Pitch and strength: Too-small pitch weakens the web; keep a connecting ligament above 0.15 mm for the chosen thickness.
5. Cleaning and debris: Specify ultrasonic cleaning and cleanliness level so resist residue or metal fines do not plug micro-holes.
6. Corrosion and plating: Name the medium and Ni plating or passivation needs, since a brass screen soaked in aqueous fluid can dezincify and change diameter.