What is meant by laser processing technology, that is, the processing technology of cutting, welding, surface treatment perforation and micro processing of materials by the characteristics of the interaction between the laser beam and the material.

Laser processing technology features：

Laser processing technology is non-polluting to the environment, with concentrated energy during its processing, small heat-affected zone, and no electromagnetic interference.

It can engrave and cut any material without causing mechanical extrusion and mechanical stress to the material.

The accuracy is able to reach 0.1mm, and the speed of laser cutting is faster than that of wire cutting.

Laser cutting slit between 0.1-0.2mm, low processing cost, large workpiece does not require any mold manufacturing and the cutting surface is relatively smooth.

Laser processing technology with computer programming can maximize material utilization.

Laser processing technology application

Laser cutting in the sheet metal cutting process irradiates the cutting material by a high power density laser beam, causing holes to form in the cutting material, which become successively narrower as the beam moves against the material.

Laser welding uses high energy laser pulses to heat small localized areas of the material so that the energy diffuses to the interior of the material using heat conduction to form a specific molten pool.

Laser engraving, i.e. laser marking and laser engraving, uses a high energy density laser to locally irradiate the workpiece to vaporize the surface material or undergo a chemical reaction of color change to realize various words, symbols and patterns, etc. This laser laser engraving process is suitable for the marking of metal, plastic, glass, ceramic, wood, leather and other materials.

Laser punching speed, high efficiency, low cost of economic effect, able to be carried out in hard, brittle, soft and other types of materials, only suitable for hardness, high melting point material punching, so in the high precision, micron-level products are mostly used in the process of etching.