Overview

A nickel acoustic mesh is the micro-perforated cover that protects microphone, receiver and speaker ports in phones, hearables and rugged devices while letting sound through and keeping water and dust out. The factory runs both precision electroforming and photo chemical etching: the acoustic mesh itself is electroformed, growing a thin nickel foil with tightly controlled micro-holes, while the matching waterproof support ring and mounting frame are produced by photo chemical etching from stainless sheet. Splitting the two parts between the two processes gives an acoustically transparent mesh and a rigid, bondable frame at the same time.

This hybrid route solves a problem a single process cannot. Electroforming reaches hole diameters down to 0.04 mm and open areas near 45% without burrs, which keeps insertion loss low across the audio band; the etched frame then supplies the flat bonding land, mounting holes and stiffness the soft nickel foil lacks. Because the frame is cut by photochemical machining from the same artwork family, acoustic and mechanical drawings stay aligned, and a change to the port geometry is a film change rather than a new stamping tool.

Parameter Window

• Available Materials: electroformed nickel and nickel alloy mesh; support rings and frames in 304/316L stainless steel
• Material Thickness Range: electroformed mesh 0.03–0.15 mm, etched frame 0.1–0.5 mm
• Tolerance: ±0.01 mm on electroformed hole diameter, ±0.03 mm on frame outline
• Minimum Feature: 0.04 mm micro-holes, acoustic open area up to 45%
• Surface Options: hydrophobic and oleophobic nano-coating, PVD, blackening, gold plating, adhesive bonding ring
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Acoustic Specification — Set target insertion loss, open area and ingress rating, then fix hole diameter, pitch and mesh thickness.
2. Mandrel Preparation — Prepare the electroforming mandrel with the photo-defined hole pattern that will shape the nickel mesh.
3. Electroforming — Grow the nickel foil on the mandrel to the specified 0.03–0.15 mm thickness, then release the mesh.
4. Frame Artwork — Generate the support-ring and mounting-frame artwork registered to the mesh outline.
5. Cleaning & Lamination — Degrease the stainless frame stock and laminate dry-film resist on both faces.
6. Frame Etching — Expose, develop and etch the ring and frame so the precision etching process leaves burr-free bonding lands and mounting holes.
7. Bonding & Coating — Bond the electroformed mesh to the etched frame and apply a hydrophobic or oleophobic coating for the ingress rating.
8. Acoustic & Seal Test — Measure insertion loss, open area and water-entry pressure, then pack the assembly in trays.

Core Advantages

1. True micro-holes: Electroforming reaches 0.04 mm holes at up to 45% open area, keeping insertion loss low and flat across the audio band.
2. Burr-free acoustic path: Grown rather than punched, the mesh has no rolled edges or burrs to whistle, rattle or trap dust at the port.
3. Rigid bondable frame: The etched stainless ring gives a flat bonding land and mounting holes the soft nickel foil cannot provide alone.
4. Water and dust seal: A hydrophobic coating plus a continuous bonded frame reaches the target ingress rating without choking the sound path.
5. Two processes, one drawing: Acoustic mesh and frame share one artwork family, so geometry changes propagate cleanly to both parts.
6. Thin and light: A 0.05 mm-class mesh keeps the port assembly slim for hearables and thin handsets.

Typical Applications

• Smartphone earpieces and mics: Dust and water barriers on receiver and microphone ports with low insertion loss for clear calls.
• TWS earbuds: Sound, vent and pressure-balance ports that stay breathable while resisting sweat and sealing the cavity.
• Smartwatch speakers: Protective covers for micro speakers, tolerant of sweat and everyday splashes in a very small cavity.
• Hearing-aid ports: Acoustic meshes for tiny housings, with uniform micro-holes and no audible artifacts.
• Rugged two-way radios: Waterproof acoustic support parts that pair with gaskets to reach a high ingress rating.
• Laptop microphone arrays: Dust meshes over multiple pickup holes, with hole positions registered to the array layout.

Design Notes & Process Considerations

1. Insertion loss first: Fix the target loss curve over the audio band, then derive hole size and open area; overly small holes roll off high frequencies.
2. Open area vs sealing: Higher open area improves transmission but lowers the ingress rating, so balance hole size, pitch and coating and verify water-entry pressure.
3. State the process split: Mark the mesh as electroformed and the ring and frame as etched on the drawing so the main part is not mis-quoted as an etched component.
4. Bonding and registration: Specify bond-land width, adhesive grade and alignment marks so assembly does not block the sound port or leave a leak path.
5. Coating durability: Call out contact angle and resistance to sweat and salt spray, and re-check coating life for outdoor or sports use.
6. Drawing completeness: List hole size, open area, mesh thickness, frame thickness, bond land and ingress rating together to cut prototype rounds.