Overview

Micro mesh chemical etching produces precision screens by dissolving a dense, repeated pattern of holes through thin metal, so the two numbers that define the part are mesh count and open area ratio. A 304 or 316L stainless, copper or nickel sheet from 0.02 mm to 0.50 mm is laminated on both faces, exposed with the hole array, and etched until the apertures break through with straight, burr-free walls. Hole diameters from 0.03 mm to 0.50 mm and mesh counts from about 20 to 500 openings per inch are routine, with open area tuned anywhere between 20% and 70%.

Because every hole on the panel is etched at the same time, hole size and web width stay uniform across the full sheet, which is what filtration, shielding and acoustic parts depend on. A micro mesh chemical etching supplier controls open area by trading hole diameter against web width, and double-sided etching keeps the walls straight so flow and attenuation are predictable. The process adds no burr, no woven-wire crimp and no mechanical stress, so the mesh stays flat and can be supplied in panels, frames or diced pieces with optional plating.

Parameter Window

• Available Materials: 304/316L stainless, C1100 copper, nickel 200/201, and nickel-iron alloys
• Material Thickness Range: 0.02–0.50 mm (web width held at or above one material thickness)
• Tolerance: hole diameter ±0.01 mm, pitch ±0.02 mm, open area ±2% of target
• Minimum Feature: 0.03 mm round hole, 0.05 mm slot, 0.05 mm web, mesh count up to 500 per inch
• Surface Options: as-etched, electropolished, nickel/gold plating, passivated, framed, diced, protective liner
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Pattern Definition — Fix mesh count, hole shape, pitch and target open area, then compute the required web width and verify it against gauge.
2. Material Selection — Match alloy to the environment and certify gauge and flatness before any lamination.
3. Cleaning & Lamination — Degrease and laminate dry film on both faces to avoid bubbles inside dense hole arrays.
4. Dual-Side Exposure — Register front and back artwork to shared fiducials and bias hole size to offset lateral etch.
5. Development & Inspection — Develop both sides and inspect the resist for pinholes or blocked apertures under magnification.
6. Two-Side Etching — Etch from both faces in alloy-matched chemistry until breakthrough, holding wall straightness and web width.
7. Stripping & Finishing — Strip resist, electropolish or plate, then frame, dice or laminate with a protective liner.
8. Metrology & Pack — Measure hole diameter, open area and pitch against the approved sample, then pack flat between sheets.

Core Advantages

1. Uniform mesh count and open area: Simultaneous etching keeps every hole identical, so flow, shading and attenuation are consistent across the panel.
2. Tooling-free patterns: A micro mesh chemical etching run needs only a film, so a new mesh count or hole shape carries no die charge.
3. Burr-free straight walls: Double-sided etching gives clean, vertical apertures with no recast, crimp or loose wires to shed particles.
4. Flat, stress-free sheets: No weaving or punching means the screen stays flat and bonds evenly into a frame or housing.
5. Wide material choice: Stainless, copper and nickel run on the same line, so corrosion, conductivity and shielding needs are all covered.
6. Fine features at high density: Sub-0.05 mm holes with narrow webs are practical where woven wire cannot hold a stable geometry.

Typical Applications

• Precision filter screens: Stainless meshes for fuel, hydraulic and pharmaceutical filtration with a controlled cut point.
• Battery and fuel-cell meshes: Copper or nickel current collectors and gas-diffusion backing with tuned open area.
• EMI / RF shielding grids: Conductive screens that block interference while letting air and light pass.
• Acoustic and speaker meshes: Fine perforated screens that protect drivers with minimal sound loss.
• Analytical sieves and sample grids: Calibrated apertures for particle sizing and microscopy support.
• Optical attenuation and encoder grids: Registered hole arrays used for light reduction and position sensing.

Design Notes & Process Considerations

1. Mesh count versus open area: State both figures together; raising mesh count at fixed hole size shrinks open area, so the two must be balanced.
2. Minimum web width: Keep the web at least equal to material thickness, or holes merge during breakthrough and the panel loses strength.
3. Side-etch compensation: Bias the artwork hole diameter to offset roughly one material thickness of lateral undercut per side.
4. Hole shape and pitch: Choose round, hex, square or slot patterns deliberately, since slot orientation changes stiffness and flow direction.
5. Flatness and handling: Call out flatness per 100 mm and specify framed or lined delivery for gauges below 0.10 mm.
6. Edge and dicing allowance: A micro mesh chemical etching drawing should include a solid border and note whether parts are paneled or singulated.