Overview

An etched spray orifice plate is a thin metal plate carrying a field of tiny holes that turn a pressurized liquid into a uniform spray, with each hole formed by photochemical machining rather than drilling or laser perforation. A photoresist mask is exposed with the hole pattern, developed, and the bare metal is dissolved through the sheet, so every orifice opens with a clean, burr-free wall and a consistent diameter. Materials are typically stainless steel 304/316L and nickel 200, in thicknesses from 0.05 mm to 0.5 mm. Because the hole size and pitch are defined by film artwork, an etched spray orifice plate delivers orifice-to-orifice uniformity and array-level pattern accuracy that mechanical perforation cannot match.

The value of the etched plate lies in the spray quality it produces. Hole diameters down to about 0.03 mm with diameter tolerance of ±0.005 mm keep the droplet size and flow distribution consistent across the whole plate, while the smooth, burr-free hole walls reduce clogging and let the fluid shear cleanly into droplets. Etching also lets the hole pattern be tailored freely — circular, slotted, or graduated arrays on a single plate — and it keeps the plate flat and stress-free so it seals evenly into a nozzle body. This makes the part a key component in atomizers, fuel injectors, aerosol valves and precision dispensing heads.

Parameter Window

• Available Materials: stainless steel 304/316L, nickel 200, molybdenum
• Material Thickness Range: 0.05–0.5 mm
• Tolerance: hole diameter ±0.005 mm, hole pitch ±0.01 mm, plate outline ±0.05 mm
• Minimum Feature: 0.03 mm hole diameter at 0.05 mm stock
• Surface Options: electropolish, passivation, nickel plating, black oxide
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Hole Pattern Review — Convert the orifice drawing to vector artwork, check hole diameter, pitch and array geometry against material thickness.
2. Material Selection — Match alloy and finish to the fluid; stainless for corrosion resistance, nickel for chemical compatibility.
3. Cleaning & Lamination — Degrease the sheet and laminate dry film resist so no bubbles or dust sit over the fine hole sites.
4. UV Exposure — Expose through high-resolution film with the hole pattern registered to the sheet edge for array-level accuracy.
5. Development — Wash out unexposed resist to open the hole sites, then inspect for under-developed or blocked apertures.
6. Etching — Through-etch from both sides to keep holes round and walls straight, controlling diameter through time, temperature and agitation.
7. Stripping & Finishing — Remove resist, neutralize, then electropolish or passivate to smooth hole walls and resist corrosion.
8. Inspection & Packaging — Measure hole diameter, pitch and wall finish optically, then pack plates flat on liner in rigid trays.

Core Advantages

1. Uniform orifice diameter: Hole size holds to ±0.005 mm across the array, keeping droplet size and flow distribution consistent.
2. Smooth, burr-free walls: Chemical etching leaves no burr or recast, so holes resist clogging and shear fluid cleanly.
3. Fine hole capability: Orifices down to 0.03 mm diameter are achievable, finer than most drilling or punching.
4. Free pattern design: Circular, slotted or graduated arrays on one plate, with no extra tooling for layout changes.
5. Flat, stress-free plate: The plate stays flat and seals evenly into the nozzle body without leaks.
6. No tooling cost: Each hole pattern is a new film, so prototype spray heads and design revisions stay economical.

Typical Applications

• Atomizer nozzle plates: Fine hole arrays for perfume, disinfectant and coating atomizers.
• Fuel injector plates: Precision orifices that meter fuel flow in injector and burner nozzles.
• Aerosol valve plates: Small metering holes for aerosol valves and metered-dose devices.
• Dispensing heads: Orifice plates for adhesive, solder paste and reagent dispensing systems.
• Humidifier and mist plates: Fine spray plates for humidifiers, misters and fogging systems.
• Irrigation and cooling sprays: Uniform hole arrays for drip and spray irrigation or component cooling.

Design Notes & Process Considerations

1. Hole diameter versus thickness: Keep hole diameter at least 0.6 × material thickness so through-etching yields a round, straight-walled hole.
2. Pitch and pattern callout: Specify hole pitch and array pattern, and note circular versus slotted or graduated layouts.
3. Wall finish: Name electropolish or passivation for smooth, clog-resistant walls and corrosion protection.
4. Flatness: Call out flatness per 100 mm so the plate seals evenly against the nozzle body without bypass leaks.
5. Material compatibility: Match the alloy to the fluid chemistry; nickel suits aggressive media where stainless may corrode.
6. Edge and handling: Require burr-free handling; an etched spray orifice plate should state hole diameter, pitch and wall finish on the drawing.