Overview

A custom copper perforated metal sheet is a thin copper panel carrying a dense array of precisely placed micro-holes, produced by photochemical etching rather than punching or drilling. A photoresist mask is imaged with the hole pattern on both faces, developed, and the unprotected metal is dissolved, so every aperture is formed in the metal itself with straight, burr-free walls. Stock is typically oxygen-free copper C10100 or tough-pitch C110 between 0.05 mm and 0.8 mm. Because no die touches the sheet, a custom copper perforated metal sheet leaves the line flat and stress-free, and its open area repeats identically across a production run — an important trait when the sheet also carries current or heat.

For buyers, the custom copper perforated metal sheet targets a different need than decorative brass mesh: copper's high electrical and thermal conductivity makes the perforated panel a functional EMI shield, a current-spreading electrode or a heat-exchanger face. Etching turns the hole array into artwork, so changing pitch or diameter is a new film rather than a new tool. That keeps prototypes fast and revisions cheap while preserving the conductivity that punching burrs and laser slag would otherwise disrupt at the hole edge.

Parameter Window

• Available Materials: oxygen-free copper C10100, tough-pitch copper C110, phosphor bronze, brass as an alternative
• Material Thickness Range: 0.05–0.8 mm (0.1 mm and 0.2 mm common for shielding and electrode foils)
• Tolerance: ±0.015 mm on hole diameter, ±0.025 mm on hole position, ±0.05 mm on outline
• Minimum Feature: 0.1 mm hole diameter, 0.1 mm minimum web, 0.2 mm hole pitch at 0.1 mm stock
• Surface Options: bare passivated, anti-tarnish, Ni/Au plating, black oxide for low reflectance, PSA backing
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Artwork Review — Vectorize the hole array, check diameter, pitch and web against foil thickness, and set registration targets.
2. Material Selection — Choose oxygen-free or tough-pitch copper for conductivity needs; confirm temper, flatness and surface quality.
3. Cleaning & Lamination — Degrease and laminate dry-film resist on both faces under controlled heat and pressure to avoid bubbles over fine holes.
4. UV Exposure — Expose both sides through high-resolution film registered to the sheet edge so top and bottom patterns align.
5. Development — Wash out unexposed resist to open every aperture, then inspect for residual film that would block a hole.
6. Etching — Spray copper-matched chemistry; time, temperature and conveyor speed set sidewall straightness and final diameter.
7. Stripping & Finishing — Remove resist, neutralize, then passivate, plate or blacken; keep ultra-thin foil on a carrier to avoid distortion.
8. Inspection & Packaging — Measure hole diameter, position and web width on a vision system, verify open area, then pack on liner or in trays.

Core Advantages

1. Conductive hole edges: Burr-free chemical edges keep copper's electrical and thermal paths intact, unlike punched or laser-cut edges.
2. No hard tooling: A new pitch or diameter is a new film, so short runs and frequent revisions stay economical without a die.
3. Very fine, dense arrays: 0.1 mm holes with 0.1 mm webs hold on 0.1 mm foil, giving high open area at fine pitch.
4. Flat, stress-free foil: Whole-sheet etching adds no mechanical stress, so thin copper stays flat for lamination or bonding.
5. Batch consistency: All holes on a sheet form together, keeping diameter, open area and sheet resistance uniform within a lot.
6. Functional surface: A custom copper perforated metal sheet combines conductivity with precise etched apertures for shielding and thermal parts in one piece.

Typical Applications

• EMI shielding panels: Perforated copper shields that vent enclosures while attenuating electromagnetic interference.
• Electrode and current collectors: Hole-perforated copper electrodes in electrolysis and battery cells that pass electrolyte or gas.
• Heat-exchanger faces: Micro-perforated copper sheets in compact heat exchangers where open area sets flow and transfer.
• Grounding and Faraday grids: Fine copper meshes for shielding windows and grounding planes with stable sheet resistance.
• Acoustic and dust filters: Copper micro-mesh in microphones and instruments that is easy to blacken and solder.
• Vacuum and aperture masks: Perforated copper masks in deposition and optical setups where a clean edge matters.

Design Notes & Process Considerations

1. Hole-to-thickness ratio: Keep the minimum hole near or above foil thickness; a 0.1 mm hole in 0.1 mm copper needs an etch-factor allowance.
2. Web and sheet resistance: Hold the ligament above roughly 0.8 × thickness, since narrow webs raise sheet resistance and can break during etching.
3. Open-area callout: State open-area percentage or total hole count, and leave a solid border of at least 2 mm for clamping and grounding contact.
4. Etch factor and size: Specify finished hole size, not film size, and allow for the double-sided etch taper in thicker stock.
5. Finishing and conductivity: Note anti-tarnish, plating or blackening; heavy plating shrinks holes and changes surface resistance, so remeasure after finishing.
6. Carrier and sampling: Approve a sample for hole size, open area and sheet resistance, then lock film and etch parameters for a custom copper perforated metal sheet.