Overview

Custom copper atomizing screen production uses photochemical machining to cut dense micro-hole arrays into thin copper foil without mechanical force or a stamping die. A photoresist mask is exposed with the hole artwork, developed, and the unprotected metal is dissolved in a copper-matched etchant, so hole diameter, pitch and taper are set by the artwork and etch time rather than by tool pressure. Typical substrates are C1100/C1020 copper and brass, supplied between 0.03 mm and 0.2 mm. Because the process is chemical, the screen leaves the line flat and burr-free, with no rolled edges, die wear or heat tint that would disturb the spray cone or shed particles into the nozzle.

For buyers, this process solves three recurring problems. Atomizers need thousands of identical micro-holes that set droplet size and flow rate, yet punching or drilling such holes in soft copper is slow and inconsistent; hole taper and entry geometry must be controlled to shape the spray cone; and copper tarnishes, so a finish must protect the surface without clogging 0.04 mm openings. Chemical machining forms every hole on a sheet at the same rate, holding diameter and pitch from the first sample through volume production, and copper's workability suits both flat screens and formed cones.

Parameter Window

• Available Materials: C1100/C1020 copper, brass; also 316L stainless and nickel for mixed builds
• Material Thickness Range: 0.03–0.2 mm
• Tolerance: ±0.01 mm on hole diameter, ±0.02 mm on pitch
• Minimum Feature: 0.04 mm hole diameter, 0.03 mm web width
• Surface Options: electropolishing, passivation, nickel plating, ultrasonic cleaning
• Compliance: ISO 9001 process control, RoHS/REACH material traceability

Manufacturing Process / Workflow (8 Steps)

1. Artwork & Nesting — Convert the micro-hole array to vector art, check the hole-to-thickness ratio, and plan sheet layout with shared registration marks.
2. Material Certification & Prep — Verify copper grade, mill certificate and thickness, inspect for scratches and flatness, then shear to exposure size.
3. Cleaning & Lamination — Degrease and laminate dry film resist under matched heat and pressure so no bubbles sit over fine holes.
4. UV Exposure — Expose through high-resolution film with the array registered to the sheet edge for panel-level hole consistency.
5. Development — Wash out unexposed resist to open the hole areas, and inspect for under-developed residue that would block etching.
6. Controlled Etching — Spray copper-matched chemistry, tuning time, temperature and conveyor speed to hold hole diameter and entry taper.
7. Stripping & Finishing — Remove resist, neutralize, then electropolish, passivate or plate without closing the micro-holes.
8. Inspection & Packaging — Measure hole diameter, pitch and flow on a vision system, verify flatness, then pack on liner or in clean trays.

Core Advantages

1. Burr-free flow: Chemical removal leaves no rolled edge, so droplets form cleanly and no particles shed into the nozzle.
2. No die cost: Each new hole array is a new film, keeping prototypes and frequent revisions economical without a stamping tool.
3. Uniform micro-holes: 0.04 mm holes and 0.03 mm webs form together across a sheet, giving even droplet size and flow rate.
4. Controlled taper: Etch time and sidewall control let the entry geometry be tuned to the target spray cone and breakup length.
5. Stress-free flatness: With no shear or heat input, thin foil stays flat, so forming into a cone will not crack or warp the hole field.
6. Clog-free finish: custom copper atomizing screen work can polish, passivate or plate with a film thin enough to keep micro-holes fully open.

Typical Applications

• Fuel and burner nozzles: Micro-hole screens that meter fuel and shape a fine, even spray cone.
• Medical nebulizers: Fine aperture plates that set droplet size for inhalation and dosing devices.
• Humidifier and misting: Atomizer discs that break water into a uniform mist with thousands of identical holes.
• Perfume and dispensing: Precision spray screens for cosmetic and fragrance dispensers needing a consistent plume.
• Agricultural spraying: Calibration and nozzle screens that hold a repeatable droplet spectrum.
• Inkjet and coating: Orifice arrays for printing and coating heads that demand tight hole-to-hole consistency.

Design Notes & Process Considerations

1. Hole-to-thickness ratio: Keep hole diameter at or above material thickness; too small a hole distorts from undercut and skews the flow rate.
2. Flow-rate callout: State hole diameter, pitch, hole count and target flow so open area can be tuned to the droplet spec.
3. Entry taper: Define whether the hole is straight or tapered and from which side, since the entry geometry shapes the spray cone.
4. Nesting and tie bars: Leave enough tie bars and process borders, and specify the final cut method so thin webs survive stripping and cleaning.
5. Thin-foil handling: For foil below 0.05 mm, specify a carrier or liner and call out flatness and cleanliness to avoid creases and fingerprints.
6. Finish and flow test: With custom copper atomizing screen, define plating thickness, residual-ion limits and a flow test so micro-holes stay open.