Scientific development of people's demand for packaging metal substrate is also increasing, so what is called packaging metal substrate (also known as packaging cover), is actually a kind of communication equipment, semiconductors, hybrid integrated circuit device, industrial lasers, etc. for packaging, the basic function is to protect the circuit chip from the surrounding environment (including the impact of physical and chemical), widely used in integrated circuits and integrated chip packaging, wafer packaging, in the original microelectronics packaging, is the use of metal cans as a shell, with complete isolation from the outside world, gas-tight method to protect the fragile electronic components.Digital transformation under the epidemic、5Getc. promote thePackaging substrates(High performance of high-end serversCPU、AI(chip and other directions) demand is increasing sharply, according to the "semiconductor industry watch" reported future packaging substrate to maintain10%around double-digit growth rates that continued into2026The market size is expected to reach around the year140billion-150billion share.

Encapsulated metal substrates Commonly used materials are stainless steel, copper and copper alloy, fungible alloy materials, the thickness (tolerance) used is generally 0.05mm / 0.06mm / 0.07mm / / 0.08mm 0.09mm / / 0.1mm / 0.12mm / 0.15mm / 0.2mm / 0.25mm / 0.3mm / 0.4mm / 0.5mm and other thickness. The encapsulated metal substrate is suitable for parallel seam welding capping process, processed by chemical etching process, the material is 4J42, its thin edge and thick middle feature not only meet the welding process requirements, but also ensure that the encapsulated metal substrate has a certain compressive strength, according to the size of the shape Encapsulated metal substrates Choose from two different thicknesses. Etching through Jolyta has the following features：

一、Low mold opening fee.Etching of encapsulated metal substratesThe film can be drawn in two hours, and any design changes can be made to reduce design development costs.

二、Chemical etching process can realize the semi-etching of metal, add company LOGO and realize branding raw to prevent theft.

三、Etching process can guaranteeEncapsulated metal substratesThe products are of high precision, with accuracy up to +/-0.01mm, and processed with stable quality, clear batches and strict quality control system. We can meet the needs of different customers' packaging and so on.

四、Etching process productionEncapsulated metal substratesWe can produce batch quality and quantity, and we can also handle small and diverse products. The opportunity to realize customized services for different customers at home and abroad.

We have a dedicated prototype engineering team to achieve fast delivery of small quantities with quality assurance

五、The chemical etching process produces encapsulated metal substrate products without burrs, pressure points, no deformation of the product, and no change in material properties.

六、The chemical etching process can be processed on both thick and thin materials and different materials of metals, and customers can use it according to their actual needs. The thickness and material of the material to be processed is selected according to the requirements, and different formulations of chemical solutions are applied to different materials.