Custom etched parts are bespoke thin metal components manufactured through photochemical etching, also called chemical etching. Unlike standard off-the-shelf components, every part geometry is customized according to customer CAD drawings. This subtractive fabrication method selectively removes unwanted metal from thin metal foil using photoresist masking and chemical etchant, making it ideal for complex micro features that are challenging for conventional machining.

We can produce custom etched parts from a wide range of metal materials: stainless steel, copper, phosphor bronze, Kovar, nickel, molybdenum, titanium, nitinol and other specialty alloys. Common custom products include precision shims, spring contacts, filter screens, encoder discs, SMT stencils, fuel cell bipolar plates, lead frames, EMI shielding sheets and medical micro components.

Etching Workflow

1. Material Pre-treatment: Raw metal foil undergoes degreasing, oxide removal and full rinsing to eliminate surface contaminants, preventing pattern defects and pinholes.
2. Photoresist Lamination: Dry film photoresist is laminated on one or both sides of the metal sheet to form a protective mask layer.
3. UV Exposure & Development: Custom CAD patterns are transferred onto photoresist by UV exposure. The unexposed resist is washed away in the development process to expose metal areas for etching.
4. Controlled Spray Etching: Automated conveyor spray etching removes exposed metal. Process parameters including temperature, etchant concentration and spray pressure are precisely regulated. Both through-etch and half-etch options are available for custom requirements.
5. Resist Stripping & Cleaning: The remaining photoresist is stripped with alkaline solution, followed by multi-stage rinsing and drying to remove chemical residues.
6. Inspection & Secondary Processing: Dimensional and visual inspection. Optional post-processing includes plating, conductive coating, heat treatment, forming and surface passivation as per custom specifications.

Core Advantages

• Fully custom geometry: Designs are based on customer drawings, no fixed standard sizes.
• Burr-free and stress-free: No stamping or cutting force, so custom parts stay flat without microcracks.
• Low-cost prototyping: No expensive hard tooling, fast iterations for design changes.
• Micron-level precision: Accurate control of hole size, line width and etch depth for micro features.
• Consistent batch quality: Stable geometry from prototype to high-volume mass production.
• Broad material compatibility: Supports most thin engineering metals and shape memory alloys.

Application Fields

• Semiconductor packaging: Custom lead frames, shadow masks, BGA & FCBGA stencils
• Hydrogen energy: Custom flow field bipolar plates for fuel cells
• Medical device: Custom nitinol implants, surgical micro components and medical filters
• Aerospace & unmanned systems: Custom encoder discs, shims and spacers
• Consumer electronics: Custom speaker grilles, contact springs, EMI shielding parts
• Industrial filtration: Custom metal filter meshes and screen panels

Design & Process Notes

1. Design should follow photochemical etching design rules; minimum feature size is linked to material thickness.
2. Account for side undercut during CAD design to guarantee final dimensional accuracy.
3. Half-etch service is available for custom recessed channels, grooves and depth-controlled features.
4. Ultra-thin metal substrates require careful handling in production to avoid warpage.
5. Surface finishing, plating and coating can be customized to improve conductivity, wear and corrosion resistance.