Ultra-fine pitch electroformed steel mesh is a high-precision thin metal mesh produced by electroforming technology. Although commonly called steel mesh, most ultra-fine pitch variants adopt pure nickel as the base material. Unlike etched mesh formed by chemical corrosion, electroformed mesh grows metal layer by layer in an electroplating tank, delivering unmatched aperture consistency and smooth inner hole walls.

This mesh is widely used in scenarios requiring dense, tiny and evenly distributed holes. The ultra-fine pitch design allows densely packed micro openings with minimal deviation in hole size and position across the whole sheet. It avoids burrs, edge roughness and uneven aperture issues that frequently appear in laser-cut or chemically etched mesh for ultra-fine features.

Core Features

1. Ultra-fine pitch & micron-sized apertures, precise hole positioning according to Gerber data.
2. Atom-deposited electroforming structure, extremely smooth hole walls with no burrs.
3. Excellent dimensional stability, low internal stress, minimal flatness change during use.
4. Consistent thickness and aperture geometry over the entire working area.
5. Custom fiducial marks, optional surface coating to improve wear resistance and release performance.

Typical Applications

• Semiconductor packaging ball mask stencils
• Precision test sieves and particle screening
• Medical micro-filter components
• Fuel cell and electronic flow control parts
• Optical aperture masks and micro sensing screens

Electroformed Mesh vs Chemically Etched Mesh

• Electroformed mesh: Best for ultra-fine pitch, ultra-smooth holes, high uniformity; higher cost, perfect for high-end precision applications.
• Chemical etched mesh: Lower cost, fast prototyping, suitable for relatively larger pitch micro mesh, good for R&D and small batch trial.

Process Advantages

Electroforming builds the mesh without cutting or etching the base metal. There is no heat-affected zone and no mechanical stress. Design modifications do not require expensive hard tooling, supporting fast iteration for new product development and flexible mass production.