1、Electric SparkMicro-hole processingMainly for mold punching operations, EDM is a slow processing, in the micro machinery, mechanical components, optical instruments and other fields to get wide attention, micro-hole processing force is small, processing aperture by adjusting the electrical parameters can be controlled and other advantages, but its disadvantages can not be mass production, the cost is high, 2 or 5 or so aperture can be used. 

2、Laser processing mainly processes materials below 0.1mm, electronic components, multilayer circuit boards, ceramic substrates, drilling, scribing and slicing on gemstone substrates; laser walking domain heating and decommissioning, laser etching, doping and oxidation for semiconductor processing jobs, etc., onMetal micro-hole processingLaser process is easy to produce the phenomenon of burning black, and easy to change the material of the material, the residue is not easy to clean or impossible to clean the phenomenon.

3、Linear cutting using wire electric continuous wire supply, slow-walking wire cutting machine has been popularized in the field of application, the surface roughness of the workpiece can usually reach Ra = 0.8μm and above, but the wire cutting process material is easy to deformation, batch cutting production is expensive.

4、Etching photochemical etching means removing the protective film from the area to be etched by exposure and development, contacting the chemical solution during etching, and using two positive shapes to dissolve the effect of chemical grinding from both sides to form a concave and convex or hollow molding effect. It can be used for ultra-thin workpieces with complex shapes and high density requirements that are difficult to achieve by mechanical processing.Metal micro-hole etching processIt can meet the requirements of flat parts, no burr, complex graphics, short processing cycle and low cost.

5、Micro-drill directly less than 3.175mm drill, it is mainly processed Ф0.1-Ф0.3mm, the depth to diameter ratio of more than 10.