Developments in the automotive industry are characterized by two trends: high precision and tighter tolerances; to improve operational efficiency and increasing electronic and electrical control engin

With the rapid development of minimally invasive surgery and other precision engineering, more and more tiny implantable parts are needed for miniaturization and precision, and prototype parts need to

The rapid development of the consumer electronics industry, technology tends to be high, precise, sharp, short product life cycle, rapid replacement, fast market speed, multiple types, small batch, wh

In the 5G era, the small-scale customized production model will not only gradually replace the traditional large-scale mass production, but also usher in new industrial changes in design modification,

Semiconductor, LED industry R & D technology continues to improve, the product for the performance of components, efficiency, miniaturization requirements are increasingly high, through the unique ser

Precision etching (photochemical etching) delivers high-accuracy, burr-free, stress-free micro metal parts. Supports complex micro patterns, ultra-thin foils from 0.02 mm, ideal for electronics, semic

Custom photochemical etched metal shims, washers and spacers in stainless steel, copper, brass, aluminum and titanium. Burr-free, stress-free, tight tolerances from 0.02 mm thickness for precision adj

Custom photochemical etching for molybdenum sheets and foils. Burr-free, stress-free precision Mo components for high-temperature electronics, semiconductor, medical and aerospace applications. Thickn

Photochemical sheet metal etching produces burr-free, stress-free precision thin metal components. No hard tooling, fast prototyping, suitable for stainless steel, copper, aluminum, titanium and alloy

Custom ultra-fine pitch electroformed steel mesh manufactured by nickel electroforming. Uniform micro apertures, ultra-smooth hole walls, micron-level accuracy, for semiconductor packaging, precision

Custom electroforming nickel stencils for BGA packaging. Ultra-smooth aperture walls, micron-level precision, low ball-jamming rate, ideal for fine pitch BGA and FCBGA solder ball placement in advance

Custom ball mask stencil for semiconductor flip chip, BGA and FCBGA packaging. Made by chemical etching or electroforming, micron-level precision, burr-free apertures, to realize accurate solder ball